Beneq's technical sales director explains the company's ALD-based OLED encapsulation technology

OLED Encapsulation is a very hot topic, especially for flexible OLEDs. Samsung and LG are already producing flexible OLEDs, but the search for better encapsulation technologies is still on. ALD, or Atomic Layer Deposition is one candidate for future deposition of OLED encapsulation. ALD is based on Chemical Vapor Deposition (CVD) that uses two vapors (gaseous) precursors which react on the substrate which creates a solid thin film. ALD works in relatively low temperatures which means it is suitable for all substrates including plastics.

One of the leaders in ALD is Finland's Beneq. Beneq developed an inorganic barrier film called nClear which is deposited using ALD. Beneq says that nClear provides "world class" barrier performance and can be deposited at temperatures well below 100 degrees Celsius. Beneq offers the TFS-600 (Gen-2.5, 500x400 mm) which is used for industrial-scale OLED encapsulation. Beneq's director of Technical sales, Mikko Soderlund, was kind enough to answer a few questions we had on the company's technology and business. Mikko is leading the application development and commercialization of ALD-based thin-film encapsulation technology for OLEDs. He has a PhD in Photonics from Helsinki University of Technology (2009).

Q: Mikko, thanks for agreeing to do this interview. There are several competing encapsulation technologies for OLEDs: multi-layer barriers (such as Samsung's old and slow Vitex technology), single-layer barriers (such as UDC's UniversalBarrier), ALD and others. Can you explain how ALD fares against these other technologies?