Aixtron has acquired US-based thin-film encapsulation (TFE) developer PlasmaSi for $16 million. Aixtron will combine the encapsulation technology with its OVPD OLED deposition equipment. Aixtron will also integrate PlasmaSi’s thin-film encapsulation process into its existing OLED cluster for customer demonstration purposes.
PlasmaSi developed organic thin-film deposition technology based on very low temperature silicon nitride Plasma Enhanced Chemical Vapor Deposition (PECVD). The technology can also be used to deposit large-area OLED lighting panels and flexible Integrated Circuits.
Encapsulation is one of the major challenges towards flexible OLED mass production. There are several competing TFE technologies, including ALD (Veeco's Fast-ALD, for example), Inkjet Printing (Kateeva's YieldJET Flex, for example) and Universal Display's UniversalBarrier.