Ergis launches a new OLED encapsulation film platform

Poland-based Ergis Group has developed a new solution for OLED panel encapsulation. The noDiffusion film, developed in collaboration with Ergis' partners can be adopted as both the flexible substrate and the encapsulation layer for OLED devices.

Ergis noDiffusion structure

The Ergis noDiffusion film offers high barrier properties, high level of optical transmittance and a low level of light scattering. This enables the production of OLED displays with extended lifetimes, efficiency and image properties. The noDiffusion film can also be used in the production of solar panels to increase panel efficiency and lifetimes.

Ergis says that the biggest advantage of its new film solution is the lower manufacturing costs, as the films already include an embedded encapsulation layer and could optionally include an embedded electrode layer.

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Posted: Sep 10,2020 by Ron Mertens