Applied Materials announced two new PECVD based deposition systems aimed towards the flexible OLED thin-film encapsulation market.

Applied Materials PECVD chamber photo

The two new systems are the AKT-20K (925x1500 mm substrates) and the AKT-40K (1250x2200 mm substrates). Both systems offer the ability to deposit diffusion barrier films with very low water and oxygen penetration. These high-performance films are deposited at low temperatures of <100°C. Applied says that the systems' unique vision alignment technology ensures accurate and precise mask positioning and deposition, allowing display manufacturers to eliminate photolithography and etch process steps and reduce production costs.