Encapsulix to supply ALD-TFE equipment to a leading Asian AMOLED producer

ALD equipment maker Encapsulix announced that a leading Asian AMOLED manufacturer has chosen its ALD-TFE deposition systems, to be used as flexible AMOLED encapsulation. The first tool is already under construction and will start operating in the spring of 2017.

Encapsulix says that the order was awarded following an extensive evaluation of available ALD platforms, and this confirms the technological superiority and leading cost-of-ownership of the company's ALD-TFE equipment.

In September 2016 it was reported that both Samsung and LG are aiming to switch from PECVD to ALD for their in-organic encapsulation process. The organic parts are reportedly deposited by ink-jet printing.

In June 2016 Encapsulix announced its latest ALD system (the Infinity 200) that is optimized for deposition on 200 mm substrates - for both R&D or manufacturing systems. The new system joins other Infinity ALD systems, ranging from 2.5-Gen substrates to 6-Gen substrates. In 2013 Encapsulix announced that it sold an M500 ALD deposition system to a leading OLED lighting producer in Europe.

Posted: Jan 23,2017 by Ron Mertens