ALD equipment maker Encapsulix announced that a leading Asian AMOLED manufacturer has chosen its ALD-TFE deposition systems, to be used as flexible AMOLED encapsulation. The first tool is already under construction and will start operating in the spring of 2017.
Encapsulix says that the order was awarded following an extensive evaluation of available ALD platforms, and this confirms the technological superiority and leading cost-of-ownership of the company's ALD-TFE equipment.
In September 2016 it was reported that both Samsung and LG are aiming to switch from PECVD to ALD for their in-organic encapsulation process. The organic parts are reportedly deposited by ink-jet printing.
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Posted: Jan 23,2017 by Ron Mertens
