A few months ago Aixtron acquired US-based thin-film encapsulation (TFE) developer PlasmaSi for $16 million, and today Aixtron announced that they have sold the first Optacap-200 encapsulation tool to a major Asian display manufacturer. The R&D system was ordered in Q3 2015 and will be delivered in Q1 2016.
The OptaCap-200 is a standalone R&D system that substrate sizes of 200x200 mm. This is a plasma-enhanced chemical vapor deposition (PECVD) technology that can be used to deposit highly flexible and effective barrier films for thin-film encapsulation for OLED and OPV panels.
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