UDC unveils new single layer flexible encapsulation technology

Universal Display unveiled a new single-layer hybrid organic-inorganic encapsulation technology for OLED (or other thin film devices). The new technology can be used on rigid and flexible substrates and may accelerate commercialization of plastic substrates based displays.

The new technology uses environmentally-benign and non-toxic materials in a potentially low-cost process. UDC collaborated with the Flexible Display Center (FDC) at Arizona State University to demonstrate the technology effectiveness, and the implementation was supported by the US DoD, DoE and the National Science Foundation.

Posted: Apr 20,2011 by Ron Mertens